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Latest bibliography of DEA with more than 10,000 articles
Mergoni, A. A. Emrouznejad, and K. De Witte (2025) Fifty years of Data Envelopment Analysis, European Journal of Operational Research, 326 (3): 389-412. https://doi.org/10.1016/j.ejor.2024.12.049.
CLICK HERE to download review of Fifty years of Data Envelopment Analysis
CLICK HERE to download bibliography (1978-2016)
CLICK HERE to download Supplement with list of over 10,000 articles
biblio
- Hz JS and J Buongiorno (1994). “Productivity in the Pulp and Paper Industries of the United-States and Canada – a Nonparametric Analysis.” Canadian J Forest Research 2: 2353-2361.
- Illueca M and JA Lafuente (2003). “Productivity and Scale Effect in Closely Related Firms – Evidence from the Spanish Tile Sector.” International Small Business Journal 21(2): 161-180.
- Inazumi H, KI Suzuki and K Kusumoto (1999). “New Scheme of Case-Based Decision Support Systems by Using DEA and Ga Techniques.? in Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, Institute of Electrical and Electronics Engineers Inc., USA. 3: 1036-1041.
- Inglada V, B Rey, A Rodriguez-Alvarez and P Coto-Millan (2006). “Liberalisation and Efficiency in International Air Transport.” Transportation Research Part A: Policy and Practice 40(2): 95-105.
- Huang YG-A (1989). “Using Mathematical Programming to Assess the Relative Performance of the Health Care Industry.” J Medical Systems 1: 155-162.
- Huang Z, SX Li and JJ Rousseau (1997). “Determining Rates of Change in Data Envelopment Analysis.” JORS 48(6): 591-599.
- Huang ZM, WM Cheung and HW Wang (2006). “Cone Dominance and Efficiency in DEA.” Ann Oper Res 145: 89-103.
- Hughes A and S Yaisawarng (2004). “Sensitivity and Dimensionality Tests of DEA Efficiency Scores.” EJOR 154(2): 410-422.
- Hu C-C and H-L Li (2004). “A Company Performance Measurement by Roic and DEA – an Example of Taiwan Ic Design House.” J Chinese Institute of Industrial Engineers 21(4): 369-383.
- Hu H and J Zhu (1997). “The Treatment of Non-Zero Slacks in Data Envelopment Analysis.” J Systems Engineering and Electronics 8(1): 46-50.
